RAAAM Memory Technologies, a startup company providing an ultra high-density, low-power on-chip memory technology, today announced the appointment of Hong Hao, former executive at Intel Foundry and Samsung Electronics, as Strategic Advisor. In this role, Mr. Hao will work closely with RAAAM’s executive team to support the company’s strategic growth and accelerate market engagement with customers and ecosystem partners across the USA.

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Mr. Hao brings over 30 years of leadership in semiconductor product development, and global foundry business and commercial development. Most recently, he served as Corporate Vice President and General Manager of Worldwide Business Development and Sales at Intel Foundry, and led overall business development strategy and global customer engagement execution.

Before his tenure at Intel, he served as Senior Vice President and Head of Samsung’s North America Foundry Business, where he directed commercial strategy and customer engagement, marketing, technical support, and foundry ecosystem growth. While at Samsung System LSI, he also managed the engineering execution of high-efficiency, high-performance ARM-based SoC products for mobile and data center architectures.

Over his multi-decade career, Hong Hao has established a proven track record of cultivating key client relationships, accelerating semiconductor business growth, and guiding complex SoC and ASIC initiatives. His deep domain expertise across foundry management, IP integration, and partner enablement will be invaluable as RAAAM expands its strategic footprint and commercial momentum.

“Hong Hao is a highly respected industry veteran with a successful track record in scaling foundry ecosystems and driving commercial growth,” said Robert Giterman, Co-Founder & CEO of RAAAM Memory Technologies. “As chip designers face severe SRAM scaling and power limitations, RAAAM’s GCRAM technology provides a critical, cost-effective breakthrough. Hong’s strategic guidance will be invaluable as we expand our engagement with major US semiconductor companies and ecosystem partners.”

“RAAAM’s innovative GCRAM technology addresses one of the most pressing bottlenecks in modern SoC design, achieving ultra-high memory density and power efficiency using standard CMOS processes,” said Hong Hao. “I am excited to advise RAAAM at this pivotal stage of growth. The team has engineered a genuinely disruptive solution, and I look forward to helping them extend their footprint and deepen relationships within the US semiconductor community and beyond.”

Through this strategic appointment, RAAAM reaffirms its commitment to delivering next-generation on-chip memory solutions that enable chipmakers to cut silicon area, lower power consumption, and reduce manufacturing costs, and boost performance without altering standard fabrication flows.

About RAAAM Memory Technologies Ltd.

RAAAM has developed the most cost-effective on-chip memory technology in the semiconductor industry, offering up to 50% area savings and up to 3x power reduction over high-density SRAM. Its patented GCRAM technology can serve as a drop-in SRAM replacement in SoCs and is fully compatible with standard CMOS processes, allowing designers to integrate more memory in a smaller die area and less power consumption.

For more information on RAAAM – https://raaam-tech.com

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